X-bit labs berichtet: http://www.xbitlabs.com/news/cpu/display/20041022085709.html
Advanced Micro Devices, one of the world’s leading makers of central processing units, has patented a technology that would allow the chipmaker to use so-called Peltier cooler with its future microprocessors for better heat dissipation and more efficient cooling of future chips.
In one aspect, a circuit device is provided that includes an insulating substrate, a semiconductor structure positioned on the insulating substrate and a Peltier effect heat transfer device coupled to the insulating substrate to transfer heat between the semiconductor structure and the insulating substrate, so aus einem Abstract ...
Man vermutet eben, dass künftige Prozzis in 65 nm viel mehr Wärme abgeben als heutige und eine herkömmliche Lösung in Form eines Luftkühlers nicht mehr ausreichen wird.
